Housing for an electronic component, and laser module

ABSTRACT

A housing for an electronic component, in particular for a laser diode, is provided. The housing includes a mounting area for the electronic component and has a lateral wall provided with a feedthrough for a light guide. The base wall of a basic body of the housing has both a heat sink for a thermoelectric cooler and a plurality of feedthroughs for pins for electrically connecting the electronic component.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims benefit under 35 U.S.C. §119(a) of German PatentApplication No. 10 2016 102 327.2 filed Feb. 10, 2016, the entirecontents of which are incorporated herein by reference.

BACKGROUND

1. Field of the Invention

The invention relates to a housing for an electronic component, inparticular a housing for a high-power laser diode, and also relates to alaser module with a housing including a laser diode. More particularly,the invention relates to a so-called 10-pin package or 14-pin package.

2. Description of Related Art

Optoelectronic modules with a laser are known in particular foramplifying light signals over longer distances. They are used foroptical pumping of fiber lasers. In particular so-called 10-pinbutterfly packages are available on the market. In the assembled state,this is a hermetically sealed housing which has feedthroughs for pins intwo opposite lateral walls, which pins serve to power the moduleslocated in the housing. Such a housing is known from published documentUS 2002/0070045 A1, for example.

The housing consists of a basic body with the feedthroughs, the basicbody defining a mounting area. Arranged in this mounting area is usuallyat least a laser diode, a thermoelectric cooler, and a thermistor as atemperature sensor. In order to prevent a shift in wavelength, thetemperature of the laser diode is closed-loop controlled on the basis ofthe resistance value of the thermistor, so as to keep a constanttemperature value.

In order to dissipate heat from the thermoelectric cooler, the housingcomprises a heat sink usually mounted on the base wall thereof.

The basic body moreover has a feedthrough introduced into the lateralwall for connecting the light guide.

The manufacturing of such prior art housings for electronic componentsis complex. In particular the introduction of the feedthroughs into thelateral wall of the housing poses problems.

SUMMARY

Given this background, the object of the invention is to provide ahousing for an electronic component, in particular in the form of anequipped laser module, which can be produced in a simple manner andwhich is of robust configuration and in particular exhibits hightemperature stability.

The object of the invention is already achieved by a housing for anelectronic component as disclosed herein and by a laser module whichcomprises a housing according to the invention and is equipped with athermoelectric cooler and a laser diode.

Preferred embodiments and refinements of the invention are specified bythe subject matter of the dependent claims, the description, and thedrawings.

The invention relates to a housing for an electronic component.

In particular, the invention relates to a housing for a laser diode.More particularly, the invention relates to a housing that ishermetically sealed in its assembled state and is preferably designed asa 10-pin package.

The housing comprises a basic body with an upper end and a lower end.The lower end is the end which faces the printed circuit board in themounted state.

The mounting area for the electronic component is located between theupper end and the lower end.

The basic body in particular has a trough-like shape and thereforecomprises lateral walls between which the mounting area is located.

The basic body may be closed by a cover once the electronic component(s)have been assembled.

Furthermore, the basic body comprises a lateral wall with a feedthroughfor a light guide.

In the simplest case, the feedthrough is provided in the form of athrough-hole.

Usually, a light guide is mounted using a sleeve which is welded orsoldered to the basic body and in which the light guide is embedded in apotting compound, in particular a solder.

This sleeve may as well be part of the basic body and may in particularbe integrally formed with the basic body.

According to the invention, a base wall of the basic body comprises aheat sink for a thermoelectric cooler and moreover a plurality offeedthroughs for pins for electrically connecting the electroniccomponent.

The pins are embedded in a potting compound in contrast to the basicbody which is preferably made of metal.

The feedthroughs are in particular provided in the form of a glazing,preferably a compression glazing.

A compression glazing may be provided, for example, by introducing thepins together with a glass ring into a respective through-hole of thebase wall. Then, the involved constituent parts are heated so that theglass solder melts. During cooling of the so glazed feedthrough thethrough-hole will contract more strongly due to a higher coefficient ofthermal expansion of the material of the basic body, and will compressthe glass feedthrough, in addition to the material bond with theadjacent basic body.

The heat sink for the thermoelectric cooler is also arranged on the basewall of the basic body. Thus, the pins and the thermoelectric cooler aremounted from the same direction, which simplifies manufacturing.

In the case where the feed-through is provided as a glazing it is inparticular contemplated that in a single process step the glazing isproduced by heating the involved constituent parts and at the same timethe heat sink is brazed to the basic body.

The feedthroughs for the pins are preferably arranged adjacent to theheat sink.

It is in particular contemplated that the heat sink extends on the basewall of the basic body along a direction of the major extension of thehousing, while the pins are arranged in rows adjacent to the heat sinknext to the two major sides thereof.

The heat sink may project beyond the base wall of the basic body, as iscontemplated according to one embodiment of the invention. In particularin the projecting portion, form fitting features for securing thehousing may be provided, such as openings or recesses.

It is in particular contemplated to provide the housing equipped withthe electronic components as an electronic device in the form of asurface mounted device (SMD).

In this case, the pins are angled laterally underneath the feedthroughso as to laterally project beyond the basic body.

The pins are spaced from the heat sink so that no insulation is requiredbetween the heat sink and the pins. This spacing moreover serves tocompensate for any mechanical stress caused due to the different thermalexpansion coefficients (circuit board, package). In this manner,introduction of such stress into the potting compound is reduced therebyincreasing the reliability of the sealing. Preferably, the spacingbetween the pins and the heat sink is at least 0.2 mm.

In particular in the case of an SMD device, the heat sink should haveform fitting features for mounting purposes.

However, according to another embodiment, a housing of the invention mayas well be designed as a through-hole technology (THT) device. In thiscase, the pins are not angled but extend straight out of the base wall.In the case of this type of device the latter usually need not besecured to a printed circuit board in addition to the soldered pins.

In a preferred embodiment of the invention, the basic body is a deepdrawn part.

The basic body is preferably made of a metal, in particular of steel orof an iron-nickel alloy.

The basic body preferably has a coefficient of thermal expansion between5 and 20 ppm/K, most preferably between 11 and 15 ppm/K.

In a further embodiment of the invention, the base wall of the basicbody has an increased thickness around the feedthroughs for theconnection pins.

In particular a base wall is provided which base wall has a collararound the glazing.

Thus, the wall thickness is thereby increased around the feedthroughscompared to the adjacent area, which provides a sufficiently long pathfor the feedthrough which is preferably provided in the form of aglazing, despite the small wall thickness of the basic body whichpreferably is a deep drawn part.

The wall thickness of the basic body is preferably between 0.3 and 0.7mm. If a thickening is provided around the feedthrough, the wallthickness in this area is preferably increased by at least 0.1, mostpreferably by at least 0.2 mm.

The heat sink preferably has a greater coefficient of thermal expansionthan the basic body. Preferably, the heat sink is made of copper or of acopper alloy.

After joining of the components, for example by brazing, and glazing ofthe feedthroughs, the heat sink will contract to a greater degree, dueto the higher coefficient of thermal expansion, and may thus cause ananisotropy of the pressure of the basic body on the glazing.

In operation, however, the heat sink will re-expand, which in turncounteracts this anisotropy, so that high temperature stability isprovided despite of the material combination steel/copper.

However, as is contemplated according to one embodiment of theinvention, the heat sink mounted to the basic body should keep a minimumspacing to the edge of the feedthrough in order to prevent theanisotropy mentioned above from becoming too pronounced.

However, a spacing between the heat sink and the edge of the glazing ofat least 0.15 mm, preferably at least 0.2 mm, will be sufficient. Inparticular, the spacing is less than 0.7 mm, preferably less than 0.3mm.

According to one embodiment of the invention, the base wall of the basicbody has an opening for the heat sink.

The electronic component, in particular the thermoelectric cooler, canthus be directly mounted to the heat sink.

According to one embodiment, the heat sink is mounted to the lowersurface of the base wall. In this embodiment, the solder is inparticular located on a surface of the base wall of the basic body, sothat a sufficiently large area for soldering the parts is ensured.

In particular in such an embodiment the heat sink may additionallycomprise a projection protruding into the opening of the base wall orprojecting beyond the base wall in the interior of the housing so as toproject into the mounting area. As a result, the length of the wires forelectrically connecting the electronic component may optionally bereduced.

In one embodiment of the invention, the heat sink comprises at least twomaterials having different coefficients of thermal expansion.

For example, it is contemplated to make the projection of the heat sinkfrom a material which has a lower expansion coefficient than the rest ofthe heat sink, so as to be adapted to the thermal expansion coefficientof the thermoelectric cooler.

However, as contemplated according to another embodiment, it is alsoconceivable to provide a connection of the heat sink to the basic bodyat the edge face of the opening of the basic body.

In a further embodiment of the invention, the basic body comprises aform fitting feature in order to allow for only one insertionorientation in an assembly tool. Thus, the basic body has an asymmetricshape, for example, or may have a recess or indentation, so that it canonly be introduced in one orientation during assembly. This furtherfacilitates assembly.

Furthermore, at least the basic body preferably has a coating. Inparticular, the basic body has a nickel or gold coating.

According to one embodiment of the invention, the basic body and/or acover to which the basic body is connected, comprises a circumferentialridge. This permits the basic body and the cover to be joined togetherin particularly simple manner by resistance welding. In this case, onlya sufficient electrical current has to be introduced between the basicbody and the cover. Since current density will be highest in the area ofthe ridge, a welded connection will be formed in a particularly simplemanner in this area.

Alternatively, it is also conceivable to connect the basic body and thecover by roll seam welding.

The laser module comprising the housing is in particular configured as alaser module including a high-power laser diode with a maximum outputpower of at least 200 mW, preferably of at least 350 mW.

In particular it is provided in the form of a 10-pin package whichincludes a thermistor that can be used to control the temperature of thelaser diode by means of the thermoelectric cooler.

It will be understood that the thermistor need not be provided in theform of a separate component but may as well be part of the laser diodeor part of the thermoelectric cooler, for example.

The laser diode thus preferably emits radiation of a wavelength from 900to 1000 nm.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a top perspective view of a first exemplary embodiment of ahousing for an electronic component.

FIG. 2 is a bottom perspective view of FIG. 1.

FIG. 3 is a sectional view of FIG. 1.

FIG. 4 is a detailed view of FIG. 3 taken at circle A.

FIG. 5a shows a sleeve for connection of the light guide.

FIG. 5b shows another sleeve for connection of the light guide.

FIG. 6 shows a first embodiment of a heat sink.

FIG. 7 shows another embodiment of a heat sink.

FIG. 8 shows a different embodiment of a heat sink.

FIG. 9 is a top perspective view of a second exemplary embodiment of ahousing for an electronic component.

FIG. 10 is a sectional view of FIG. 9.

FIG. 11 is a top view of FIG. 9.

FIG. 12 is a perspective view of the basic body according to oneembodiment of a housing.

FIG. 13 is a sectional view of FIG. 12.

FIG. 14 is a detailed view of FIG. 13 take at circle B.

FIG. 15 is a top perspective view of a further embodiment of a basicbody.

FIG. 16 is a bottom perspective view of FIG. 15.

FIG. 17 is a top perspective view of a further embodiment of a basicbody.

FIG. 18 is a bottom perspective view of FIG. 17.

FIG. 19 is a perspective view of another embodiment of a housing.

FIG. 20 is a sectional view of FIG. 19.

FIG. 21 is a perspective view of another embodiment of a housing.

FIG. 22 is a sectional view of FIG. 21.

FIG. 23 is a perspective view of another embodiment of a housing.

FIG. 24 is a sectional view of FIG. 23.

FIG. 25 is a perspective view of another embodiment of a housing.

FIG. 26 is a sectional view of FIG. 25.

FIG. 27 is a perspective view of another embodiment of a housing.

FIG. 28 is a sectional view of FIG. 27.

FIG. 29 is a perspective view of a housing with only 6 pins.

FIG. 30 is a partially cut-away view of the housing of FIG. 29.

FIG. 31 is a sectional view of the housing of FIG. 29.

FIG. 32 is a sectional view of one exemplary embodiment of an equippedhousing.

FIG. 33 is a sectional view of a cover that can be used for allillustrated embodiments.

DETAILED DESCRIPTION

The subject matter of the invention will now be explained by way ofexemplary embodiments of the invention with reference to the drawings ofFIGS. 1 to 33.

FIG. 1 shows a perspective view of the lower end 3 of a housing 1 for anelectronic component, in particular for a laser diode.

Housing 1 comprises a trough-shaped basic body 9 with an essentiallyrectangular outer shape.

In this view, pins 2 can be seen on the lower end 3 of the basic body,the pins extending out of the base wall of the basic body 9.

Pins 2 are arranged in two rows.

Between pins 2, a heat sink 5 is disposed, which is made of copper orother metals that exhibit high thermal conductivity.

Heat sink 5 protrudes beyond the base wall of basic body 9 and has abore 6 at one end and recesses 7 at the other end, which are used asform fitting features for securing the housing 1.

FIG. 2 is a perspective view of the upper end 4 of the basic body 9 ofhousing 1.

As can be seen, the trough-shaped basic body 9 defines, in its interior,a mounting area for an electronic component (not shown).

Pins 2 have contact portions 10 at their ends, which are arranged in theinterior of the housing 1.

Contact portions 10 serve to electrically connect the electroniccomponents located in the housing.

More particularly, the housing 1 may comprise a respective pair ofcontact portions for each of a laser diode, a thermoelectric cooler, anda thermistor.

Furthermore, a feedthrough 11 in the form of a bore can be seen, throughwhich a light guide (not shown) is introduced to be coupled with thelaser diode.

In this exemplary embodiment, the base wall 8 of basic body 9 has anopening through which the heat sink 5 is accessible from the interior.Electronic components can therefore be mounted directly on the heat sink5 within the housing.

FIG. 3 is a sectional view of the housing shown in FIGS. 1 and 2, takenin parallel and close to a small end of the housing.

It can be seen that the basic body 9 has feedthroughs 14, through whichthe pins 2 extend into the interior of the housing.

Furthermore, it can be seen that the heat sink 5 consists of a plate 12and a projection 13. The heat sink is connected to the basic body 9through projection 13.

FIG. 4 is a detailed view of section A around feedthrough 14.

Pin 2 is secured in the base wall 8 of the basic body by a glazing 15.

In this exemplary embodiment, pin 2 has a contact portion 10 of enlargeddiameter to which the wires for electrically connecting an electroniccomponent can be applied.

Furthermore, in this exemplary embodiment, an insert 16 is introducedinto the opening of base wall 8 in order to increase the depth ofglazing 15. The insert may be secured by brazing or welding, forexample. Thus, the feedthrough provides a greater length than would begiven by the base wall alone.

FIGS. 5a and 5b are schematic perspective views of a sleeve 17 which canbe used in all the illustrated embodiments for connecting the lightguide.

Sleeve 17 as shown in FIG. 5a is adapted for being mounted in thefeedthrough of the basic body by being snap connected therein.

The embodiment of a sleeve 17 as illustrated in FIG. 5b has a flangeserving to secure the sleeve by welding.

Thus, in a preferred embodiment of the invention, the sleeve 17 is aseparate component which is welded or brazed to the basic body.Therefore, the basic body can be provided as a deep drawn part.

FIGS. 6 to 8 are perspective views of different exemplary embodiments ofa heat sink.

The heat sink 5 shown in FIG. 6 has bores 6 serving as a form fittingfeature for mounting the housing.

Along the major edges between the ends of heat sink 5, the latter hasrecesses 18 extending transversely to the main extension direction. Inthe area of these recesses 18, the pins can extend outwards adjacent toheat sink 5.

FIG. 7 shows a simple heat sink 5 in the form of a plate. Such a heatsink is in particular provided in conjunction with a housing of a THTdevice design, since such a housing is usually secured solely throughthe soldered pins.

FIG. 8 shows an embodiment of a heat sink consisting of a plate 12 and aprojection 13 protruding from plate 12. The plate, again, has formfitting features for mounting purposes, in particular bores.

Projection 13 may either be fastened with its front face to the basewall of the basic body or may protrude into an opening of the basicbody.

Furthermore, projection 13 may serve to increase the spacing between thebasic body and the circuit board in the mounted state, so that the pinscan extend laterally outwards through the resulting intermediate space.

Such a heat sink 5 with projection 13 is preferably provided as aone-piece part, in particular as a milled part. However, it is alsoconceivable for heat sink 5 to be provided as a two-part component, forexample in the form of a projection 13 brazed to plate 12.

A heat sink may either be made of the same materials or as a hybridcomponent made of two different materials. The latter approach offersthe possibility to make the base of a material with a lower thermalexpansion coefficient adapted to that of the thermoelectric cooler, andthe plate of a material with higher thermal conductivity, for example.

FIG. 9 is a perspective view of another embodiment of a housing 1.

This housing again comprises a trough-shaped basic body 9 with a heatsink 5 mounted to the lower end thereof. Pins 2 extend laterallyoutwards, so this is an SMD device.

In the assembled state, the basic body 9 may be closed by a cover 19.Cover 19 is preferably connected by welding.

FIG. 10 is a longitudinal sectional view of the housing of FIG. 9.

Again, the basic body 9 in the form of a deep drawn part can be seenhere, with feedthrough 11 for the light guide.

Furthermore, it can be seen that the heat sink 5 has a projection whichis mounted with its front face to the base wall 8 of basic body 9. Theconnection is made by brazing, and in this exemplary embodiment asufficiently large circumferential braze connection area 24 is easilyprovided.

FIG. 11 is a plan view of the lower end of the housing 1. Pins 2 can beseen, emerging adjacent to heat sink 5 and extending laterally outwards.

Only pin 2 a does not extend through a feedthrough, but is directlyconnected to the basic body, since it serves as a grounding pin.

FIG. 12 is a perspective view of one exemplary embodiment of a basicbody 9.

This basic body 9 again has a trough-shaped design.

The basic body 9 has a feedthrough 11 for a light guide in a lateralwall thereof.

Furthermore, the base wall of the basic body 9 has a rectangular opening21 in its lower surface, through which the heat sink of the assembledhousing is exposed to the interior thereof.

Furthermore, nine feedthroughs 14 for the pins for connecting theelectronic components mounted in the housing can be seen.

FIG. 13 is a sectional view of the basic body 9 illustrated in FIG. 12.

Feedthroughs 14 are visible.

FIG. 14 is an enlarged view of section B in FIG. 13.

As can be seen, the base wall of the basic body has a collar 20 aroundfeedthrough 14, so that the base wall has an increased wall thickness inthe region around feedthrough 14 as compared to the adjacent area. Inthis manner, the glazing to be introduced into the feedthrough 14 willhave a sufficient length even in the case of a deep drawn part of thinwall thickness.

Such a thickening of the collar around feedthrough 14 is preferablyobtained by embossing, for example simultaneously with the deep drawing.

FIGS. 15 and 16 are perspective views of another embodiment of a basicbody 9.

As can be seen in FIG. 15, this basic body 9 also has a lateral wallwith a feedthrough for a light guide.

It can also be seen that on one side an inwardly projecting indentation22 is formed in the lateral wall 23 of the small end.

As can be seen particularly clearly in FIG. 16, the indentation 22provides a simple form fitting feature which ensures that duringassembly the basic body 9 can be inserted into a mounting tool (notshown) in only one orientation.

FIGS. 17 and 18 are perspective views of a further embodiment of a basicbody 9.

As can be seen in FIG. 17, in this exemplary embodiment the base wall 8is not thickened around the feedthroughs 14 for the pins.

However, the base wall also has an opening 21 for the heat sink.

In FIG. 18 it can be seen that like in the other previously illustratedexemplary embodiments the basic body 9 has a collar at its upper end 4,on which a cover can be attached.

FIG. 19 shows a further exemplary embodiment of a housing 1 in aperspective view.

In the case of this housing, a simple plate-shaped heat sink 5 is placedon the basic body 9.

The pins 2 are not angled but extend straight from the base wall. Thus,this device is intended for THT mounting.

FIG. 20 is a sectional view of FIG. 19.

A pin 2 for contacting an electronic component can be seen, whichextends through a feedthrough, and furthermore a pin 2 a which serves asa grounding terminal.

Base wall 8 has an opening, and the plate-shaped heat sink is solderedwith its front face to the base wall 8 without protruding into theinterior of the housing. This provides additional installation space,for example if rather thick components are assembled.

FIG. 21 shows a further exemplary embodiment of a housing, which isdesigned for SMD mounting.

For this purpose, the pins 2 which are arranged adjacent to thebone-shaped heat sink 5 are angled so as to project laterally outwards.

FIG. 22 is a sectional view of FIG. 21.

It can be seen that in this exemplary embodiment the base wall 8 of thebasic body 9 does not have any opening for the heat sink 5.

Rather, in this exemplary embodiment of the invention, cooling isachieved by heat conduction across the base wall 8 of the basic body toheat sink 5. Since the basic body preferably is a deep drawn part with asmall wall thickness, it will not be necessary in many cases tointroduce an opening into the base wall.

FIGS. 23 and 24 show a further embodiment of a housing.

In this embodiment, the heat sink 5 comprises a plate 12 and aprojection 13, as is particularly apparent from FIG. 23.

As can be seen from the sectional view of FIG. 24, the projection 13 isinserted in an opening of base wall 8.

Therefore, the solder connection 24 is made laterally.

In this exemplary embodiment of the invention, the heat sink 5terminates flush with the base wall 8 at the inner side of housing 1.

FIG. 25 shows a perspective view of a further exemplary embodiment of ahousing with a heat sink 5.

As can be seen in the sectional view of FIG. 26, the pins 2, 2 a extendlaterally away from heat sink 5.

The laterally projecting pins extend approximately at the same level asheat sink 5, whereas in the exemplary embodiment shown in FIGS. 23 and24 the heat sink has such a height that the lower end of the heat sinkis spaced from the pins.

FIGS. 27 and 28 show a further embodiment of a housing 1. As can be seenfrom FIG. 27, the housing 1 comprises a trough-shaped basic body 9 and aheat sink 5 corresponding to that of the embodiment shown in FIG. 21when looking at the lower end.

As can be seen in FIG. 28, the heat sink 5 comprises a projection 13which is soldered to the lower surface of the basic body. The base wall8 of basic body 9 has an opening 21, so that an electronic component canbe placed directly onto the projection 13 of the heat sink 5.

However, the solder connection 24 is made on the lower surface of basewall 8 and is therefore not produced laterally, in contrast to theembodiment illustrated in FIG. 26.

In this exemplary embodiment, again, pins 2 and 2 a extend laterallyoutwards, therefore this is an SMD device.

FIG. 29 shows a further exemplary embodiment of a housing 1 which hasonly 6 pins.

The housing comprises a heat sink 5.

Pins 2 are angled laterally outwards, therefore this is an SMD device.

FIG. 30 shows a partially cut-away view of FIG. 29.

As can be seen in this exemplary embodiment, a substantially roundprojection 13 of the heat sink protrudes into the interior of thehousing.

The height of the components mounted within the housing can thus beadapted to the level of the contact portion of the pin extending throughfeedthrough 14.

In the sectional view of FIG. 31 it can be seen that the projection 13of the heat sink protrudes into the interior 25 of the housing.

In this exemplary embodiment, the solder connection 24 is madelaterally.

FIG. 32 shows a sectional view of an equipped housing, that means of alaser module 30.

The laser module 30 according to this exemplary embodiment comprisesangled pins 2 and therefore is designed as an SMD device.

The heat sink 5 is inserted in an opening in the base wall of the basicbody 9 of the housing.

In this manner it is possible for a thermoelectric cooler 26 in the formof a Peltier element to be directly applied to the heat sink 5.

Thermoelectric cooler 26 is connected to pins 2 via wires 28.

A high-power laser diode 27 is mounted on the thermoelectric cooler 26.

It will be understood that this laser diode 27, too, will beelectrically connected via wires that extend to pins, which wireshowever are not visible in this view.

Furthermore, the laser module 30 preferably comprises a thermistor bywhich the thermoelectric cooler 26 is controlled so as to keep thetemperature of laser diode 27 constant during operation.

FIG. 33 shows a detailed view of a cover 19 which can be used to closethe housing shown in FIG. 32, but also the housings shown in the otherexemplary embodiments.

Cover 19 has a circumferential ridge 29 which is adapted for securingthe cover 19 to the basic body by resistance welding.

When the cover 19 is placed on the collar of the basic body, currentdensity during resistance welding will be at a maximum in the area ofridge 29, so that heating of this area will be caused whereby thecomponents are welding together.

It is equally conceivable to provide the ridge 29 on the collar of thebasic body (not shown).

Alternatively, a cover without ridge may also be used and may be appliedby roll seam welding, for example.

The invention permits to provide a housing with high temperatureresistance for high-power components such as laser diodes, which can bemanufactured in a simple manner.

LIST OF REFERENCE NUMERALS

-   1 Housing 21 Opening-   2 Pin 22 Indentation-   2 a Grounding pin 23 Lateral wall-   3 Lower end 24 Solder connection-   4 Upper end 25 Interior-   5 Heat sink 26 Thermoelectric cooler-   6 Bore 27 Laser diode-   7 Recess 28 Wire-   8 Base wall 29 Ridge-   9 Basic body 30 Laser module-   10 Contact portion-   11 Feedthrough-   12 Plate-   13 Projection-   14 Feedthrough-   15 Glazing-   16 Insert-   17 Sleeve-   18 Recess-   19 Cover-   20 Collar

What is claimed is:
 1. A housing for an electronic component,comprising: a heat sink for a thermoelectric cooler; a basic body havingan upper end and a lower end and a mounting area for the electroniccomponent located therebetween, wherein the basic body has a lateralwall with a first feedthrough provided therein, the first feedthroughbeing configured to receive a light guide, and wherein the basic bodyhas a base wall having the heat sink and having a plurality of secondfeedthroughs, the plurality of second feedthroughs being configured toreceive pins electrically connecting the electronic component.
 2. Thehousing as claimed in claim 1, wherein the plurality of secondfeedthroughs provided in the form of a glazing.
 3. The housing asclaimed in claim 1, wherein the plurality of second feedthroughs arearranged adjacent to the heat sink.
 4. The housing as claimed in claim1, wherein the basic body is a deep drawn part.
 5. The housing asclaimed in claim 1, wherein the basic body is made of metal.
 6. Thehousing as claimed in claim 1, wherein the base wall has an opening forthe heat sink.
 7. The housing as claimed in claim 1, wherein the heatsink has a coefficient of thermal expansion that is greater than acoefficient of thermal expansion of the basic body.
 8. The housing asclaimed in claim 1, wherein the basic body has a form fitting feature,wherein the form fitting feature is configured to allow for only asingle insertion orientation of an assembly tool.
 9. The housing asclaimed in claim 8, wherein the form fitting feature comprises anindentation in a lateral wall thereof.
 10. A laser module comprising thehousing as claimed in claim 1, and further comprising at least athermoelectric cooler and a laser diode mounted in the housing.
 11. Thelaser module as claimed in claim 10, wherein the laser module comprisesa laser diode with a maximum output power of at least 200 mW.
 12. Thelaser module as claimed in claim 11, wherein the laser diode emitselectromagnetic radiation of a wavelength from 900 to 1000 nm.
 13. Thelaser module as claimed in claim 11, further comprising a thermistormounted in the housing, the thermistor being adapted to control atemperature of the laser diode using the thermoelectric cooler.
 14. Thehousing as claimed in claim 1, wherein the basic body is made of steelor an iron-nickel alloy.
 15. The housing as claimed in claim 1, whereinthe basic body has a coefficient of thermal expansion between 5 and 20ppm/K.
 16. The housing as claimed in claim 1, wherein the base wall ofthe basic body has an increased thickness around the feedthroughs forthe pins.
 17. The housing as claimed in claim 1, wherein the heat sinkis made of copper or of a copper alloy.
 18. The housing as claimed inclaim 1, wherein the heat sink comprises at least two materials havingdifferent coefficients of thermal expansion.
 19. The housing as claimedin claim 1, wherein the basic body has a circumferential ridge.
 20. Thehousing as claimed in claim 1, further comprising a cover that closesthe basic body, the cover having a circumferential ridge.